US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Three-dimensional nonvolatile memory device including a plurality of memory cells" (South Korean Inventors)

पोस्टेड ऑन: 2026-09-08

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,163, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional nonvolatile memory device ... और पढ़ें

US Patent Issued to Applied Materials on Sept. 8 for "Methods and devices for 3D NAND using silicon-and-halogen-containing materials" (California Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,164, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and devices for 3D NAND using silicon-and-ha... और पढ़ें

US Patent Issued to Kioxia on Sept. 8 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,165, issued on Sept. 8, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was invented by C... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Three-dimensional semiconductor memory device including separation region and electronic system including the same" (South Korean Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,166, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional semiconductor memory devic... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Bonding type vertical semiconductor devices" (South Korean Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,167, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Bonding type vertical semiconductor devices"... और पढ़ें

US Patent Issued to SUNRISE MEMORY on Sept. 8 for "3-dimensional NOR memory array with very fine pitch: device and method" (California, Oregon Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,168, issued on Sept. 8, was assigned to SUNRISE MEMORY Corp. (San Jose, Calif.). "3-dimensional NOR memory array with very fine pitch: devi... और पढ़ें

US Patent Issued to INTEL NDTM US on Sept. 8 for "Barrier and thin spacer for 3D-NAND complementary metal-oxide semiconductor under array" (Chinese, American Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,169, issued on Sept. 8, was assigned to INTEL NDTM US LLC (Santa Clara, Calif.). "Barrier and thin spacer for 3D-NAND complementary metal-o... और पढ़ें

US Patent Issued to Kioxia on Sept. 8 for "Semiconductor memory device and method of manufacturing semiconductor memory device" (Japanese Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,170, issued on Sept. 8, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device and method of manufacturing semiconductor memory... और पढ़ें

US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Sept. 8 for "Semiconductor device structure and manufacturing method therefor" (Chinese Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,171, issued on Sept. 8, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Semiconductor device structure and manufactur... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Vertical nonvolatile memory device having hydrogen diffusion barrier layer and manufacturing method thereof" (South Korean Inventors)

पोस्टेड ऑन: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,172, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Vertical nonvolatile memory device having... और पढ़ें

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US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Three-dimensional nonvolatile memory device including a plurality of memory cells" (South Korean Inventors)

US Patent Issued to Applied Materials on Sept. 8 for "Methods and devices for 3D NAND using silicon-and-halogen-containing materials" (California Inventors)

US Patent Issued to Kioxia on Sept. 8 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Three-dimensional semiconductor memory device including separation region and electronic system including the same" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Bonding type vertical semiconductor devices" (South Korean Inventors)

US Patent Issued to SUNRISE MEMORY on Sept. 8 for "3-dimensional NOR memory array with very fine pitch: device and method" (California, Oregon Inventors)

US Patent Issued to INTEL NDTM US on Sept. 8 for "Barrier and thin spacer for 3D-NAND complementary metal-oxide semiconductor under array" (Chinese, American Inventors)

US Patent Issued to Kioxia on Sept. 8 for "Semiconductor memory device and method of manufacturing semiconductor memory device" (Japanese Inventors)

US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Sept. 8 for "Semiconductor device structure and manufacturing method therefor" (Chinese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Vertical nonvolatile memory device having hydrogen diffusion barrier layer and manufacturing method thereof" (South Korean Inventors)